ODROID N2+ 4GB ODROID N2+ 4 GB 4 x 2.4 GHz

242,54 €
VAT included
Free shipping
Environmental tax included 0,07 €
Delivery time: 2-3 days
available from 12/01/2025
Free return shipment until 31.01.2026
ODROID N2+ 4GB ODROID N2+ 4 GB 4 x 2.4 GHz
242,54 €
VAT included
Free shipping
Environmental tax included 0,07 €
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Product description

Overview

CPU: Amlogic S922X Hexa-Core CPU ARMv8-A with Big.Little architecture (Quad-Core CPU Cortex-A73 with 1.8 GHz and Dual-Core CPU Cortex-A53 with 1.9 GHz)
GPU: Mali-G52 (846 MHz) (OpenGL-ES 1.1, 2.0, 3.0, 3.0, 3.1 and 3.2 as well as OpenCL-1.2 and 2.0)
GB DDR4 memory with 32-bit 1.2 V 1320 MHz (2640 MT/s)
Connections: EMMC up to 128 GB, microSD slot (DS/HS modes up to UHS-I SDR104), HDMI 2.0 (up to 4K@60Hz with HDR, CEC, EDID), LAN (RJ45, supports 10/100/1000 Mbit/s), Audio (3.5 mm jack), 2x ADC input, RTC, IR receiver
Multi-pin connector 40-pin (2 x DC 5V, 2 x DC 3.3V, 1 x DC 1.8V, 8 x GND, 1x SPI, 1x UART, 2x I2C, 25x GPIO
Cooler fan connection: 5 V. 2-pin for optional 60 x 60 mm fan
Power consumption: IDLE: 1.9 W / CPU load: 5.5 W / shutdown: 0.2 W.
Operating voltage 12 V / 2 A (hollow socket 5.5 mm outside and 2.1 mm inside)

Description

ODROID-N2+ is a revision of ODROID-N2.
- the maximum CPU cycle of the Quad-Core Cortex-A73 has been increased from 1.8Ghz to 2.4GHz.
- the maximum CPU clock of the Dual-Core Cortex-A53 has been increased from 1.9Ghz to 2.0GHz.
- The RTC backup battery holder is mounted on the board.

The main CPU is based on the big.Little architecture, which integrates a quad-core ARM Cortex-A73 CPU cluster and a dual-core Cortex-A53 cluster with a new generation Mali G52 GPU.
Thanks to modern 12 nm silicon technology, the 2.2 GHz A73 cores run without thermal throttling, with the standard metal heat sink providing a rugged and quiet computer.
Multi-core CPU performance is about 20% faster and GPU 10% faster than N1. The DDR4+ N2 RAM runs at 1320 MHz and consumes only 1.2 volts of power.
The large heat sink in the metal housing was developed to optimize the heat dissipation of CPU and RAM and to minimize throttling. The CPU is placed on the underside of the PCB for excellent thermal properties.

Keywords

04064161208701, 03272496297630, ODROID, N2+ 4GB, arduino

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